NTMD4840NR2G【PDF 1/5 页】MOSFET N-CH DUAL 30V 4.5A 8-SOIC

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NTMD4840N

Power MOSFET

30 V, 7.5 A, Dual N ? Channel, SOIC ? 8

Features

? Low R DS(on) to Minimize Conduction Losses

? Low Capacitance to Minimize Driver Losses

? Optimized Gate Charge to Minimize Switching Losses

? Dual SOIC ? 8 Surface Mount Package Saves Board Space

? This is a Pb ? Free Device

Applications

? Disk Drives

? DC ? DC Converters

? Printers

MAXIMUM RATINGS (T J = 25 ° C unless otherwise stated)

V (BR)DSS

30 V

http://onsemi.com

R DS(on) Max

24 m W @ 10 V

36 m W @ 4.5 V

N ? Channel

I D Max

7.5 A

Rating

Drain ? to ? Source Voltage

Gate ? to ? Source Voltage

Symbol

V DSS

V GS

Value

± 20

Unit

Continuous Drain

Current R q JA (Note 1)

Power Dissipation

R q JA (Note 1)

T A = 25 ° C

T A = 70 ° C

T A = 25 ° C

I D

P D

5.5

4.4

1.14

Current R q JA (Note 2)

T A = 70 ° C

Current R q JA t < 10 s

Continuous Drain T A = 25 ° C

Steady

Power Dissipation State T A = 25 ° C

R q JA (Note 2)

Continuous Drain T A = 25 ° C

(Note 1) T A = 70 ° C

Power Dissipation T A = 25 ° C

R q JA t < 10 s (Note 1)

Pulsed Drain Current T A = 25 ° C,

t p = 10 m s

Operating Junction and Storage Temperature

Source Current (Body Diode)

Single Pulse Drain ? to ? Source Avalanche

Energy T J = 25 ° C, V DD = 30 V, V GS = 10 V,

I L = 7.5 A pk , L = 1.0 mH, R G = 25 W

I D

P D

I D

P D

I DM

T J , T STG

I S

EAS

4.5

3.5

0.68

7.5

6.0

1.95

? 55 to

+150

2.0

° C

4840N = Device Code

A = Assembly Location

Y = Year

WW = Work Week

MARKING DIAGRAM

& PIN ASSIGNMENT

D1 D1 D2 D2

SOIC ? 8 4840N

CASE 751 AYWW

STYLE 11 G

S1 G1 S2 G2

G = Pb ? Free Package

Lead Temperature for Soldering Purposes

(1/8 ″ from case for 10 s)

THERMAL RESISTANCE RATINGS

T L

260

° C

ORDERING INFORMATION

Shipping ?

Device

Package

Rating

Symbol

Max

Unit

NTMD4840NR2G

SOIC ? 8

2500/Tape & Reel

Junction ? to ? Ambient – Steady State (Note 1)

R q JA

110

(Pb ? Free)

° C/W

Junction ? to ? Ambient – t ≤ 10 s (Note 1) R q JA 64

Junction ? to ? FOOT (Drain) R q JF 40

Junction ? to ? Ambient – Steady State (Note 2) R q JA 183.5

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. Surface ? mounted on FR4 board using 1 inch sq pad size, 1 oz Cu.

2. Surface ? mounted on FR4 board using the minimum recommended pad size.

?For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

? Semiconductor Components Industries, LLC, 2009

September, 2009 ? Rev. 1

Publication Order Number:

NTMD4840N/D

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